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Low Temperature Metal Coating Method
B. Background
A new metal coating method, called KEM (kinetic energy metallization), demonstrated
in the laboratory by Inovati, utilized fast-moving solid particles entrained in a gas that
are caused to flow through a nozzle to effect particle deposition on metal surfaces at
room temperature conditions. This method (US Patent 5,795,626) was an attractive and
viable alternative to the currently available high-temperature coating methods
available.
Since it differs significantly from existing metal coating technologies, a brief description
of the method is included here. The proposed method, KEM, achieves cohesive and
adhesive metallurgical bonding through the high-speed collision of powder with a
substrate and the subsequent discharge of electrical charge at the substrate. Such
coating is effected by entraining metal powder in a gas and accelerating this mixture
through a supersonic nozzle. The gas/powder is directed towards the substrate to be
coated. Collisions occur, initially between the powder and the substrate, and, as the first
layer of the coating forms, between the powder and the coating. During these collisions
the powder is rapidly deformed, causing the exposure of fresh (oxide free) active metal
surface. When these active surfaces contact one another, they agglomerate and form
true metallurgical bonds. The resultant coating has low porosity and high adhesive and
cohesive strength. The formation of metallurgical bonds is potentiated by the discharge
of electrical energy. This electrical energy is the result of triboelectric charging of the
particles during acceleration and transit to the nozzle.
An advantage of the method is that it does not raise the temperature of the powder
being applied or that of the substrate. Consequently, materials sensitive to high
temperature may be applied without changing the properties of the material or
substrate. |
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